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折優惠：HK$51.2
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LED PACKAGING FOR LIGHTING APPLICATIONS DESIGN, MANUFACTURING, AND TESTING
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沒有庫存
訂購需時10-14天
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9780470827833 | |
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Liu | |
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全華圖書 | |
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2011年1月01日
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487.00 元
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HK$ 462.65
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詳
細
資
料
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叢書系列：實用電子
規格：精裝 / 320頁 / 普級 / 單色印刷 / 初版
出版地：台灣
實用電子
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分
類
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[ 尚未分類 ] |
同
類
書
推
薦
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內
容
簡
介
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本書特色
In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.
1. One of the only books to cover LEDs from package design to manufacturing to testing
2. Focuses on the design of LED packaging and its applications such as road lights
3. Includes design methods and experiences necessary for LED engineers, especially optical and thermal design
4. Introduces novel LED packaging structures and manufacturing processes, such as ASLP
5. Covers reliability considerations, the most challenging problem for the LED industry
6. Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures
7. Codes and demonstrations available from the book’s Companion Website
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目
錄
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Foreword (Magnus George Craford).
Foreword (C. P. Wong).
Foreword (B. J. Lee).
Preface.
Acknowledgments.
About the Authors.
Ch1: Introduction.
Ch2: Fundamentals and Development Trends of High Power LED Packaging.
Ch3: Optical Design of High Power LED Packaging Module.
Ch4: Thermal Management of High Power LED Packaging Module.
Ch5: Reliability Engineering of High Power LED Packaging.
Ch6: Design of LED Packaging Applications.
Ch7: LED Measurement and Standards.
Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance.
Index.
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